R39.00
6 available
Description
This thermal compound is a high-quality thermal interface material used to improve heat transfer between a CPU/GPU and a heatsink. It is designed to fill microscopic gaps between the processor heat spreader and the heatsink, ensuring efficient cooling and thermal conductivity.
Product Highlights:
- High Thermal Conductivity: Provides effective heat transfer from the CPU/GPU to the heatsink.
- White Color: The white color allows for easy application and spreading, aiding in monitoring the coverage and ensuring neat installations.
- Non-Curing: Does not dry out, harden, or set over time, maintaining its effectiveness for extended periods.
- Non-Corrosive: Will not cause damage to CPU/GPU components or the heatsink.
- Wide Compatibility: Suitable for use with CPUs, GPUs, and other semiconductor devices.
- Easy Application: Comes in a syringe or tube for easy dispensing and precise application.
